Region

Ferrotec Global

Patterning 

Replacement demand for our materials such as quartz, ceramics, silicon parts,
and silicon carbide is growing in proportion to the increase in production by semiconductor customers.
We offer a variety of semiconductor-related products, including a thermoelectric cooler module, which has recently been adopted as a cooling plate of manufacturing equipment for controlling the wafer temperature.

1
Silicon base

1. Silicon Ingot Cutting

[Products used in this process]
●Silicon Wafers

2
Silicon base

2. Silicon Wafer

[Products used in this process]
●Silicon Wafers

3
Silicon base

3. Oxidation and Diffusion

[Products used in this process]
●Vacuum Seals
●Quartz Products
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon carbide parts

4
Transistor Layer

4. Lithography


[Products used in this process]
●Vacuum Seals
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon Wafers
●Process Parts Cleaning
●Thermo-electric Modules
●CMS

5
Transistor Layer

5. Lithography


[Products used in this process]
●Vacuum Seals
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon Wafers
●Process Parts Cleaning
●Thermo-electric Modules
●CMS

6
Transistor Layer

6. Lithography


[Products used in this process]
●Vacuum Seals
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon Wafers
●Process Parts Cleaning
●Thermo-electric Modules
●CMS

7
Transistor Layer

7. Etching


[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon carbide parts
●Silicon parts
●Process Parts Cleaning
●CMS

8
Transistor Layer

8. Cleaning


[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon carbide parts
●Silicon parts
●Process Parts Cleaning
●CMS

9
Transistor Layer

9. CVD


[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon carbide parts
●Silicon parts
●Process Parts Cleaning
●CMS

10
Transistor Layer

10. CMP

[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●Silicon parts
●Process Parts Cleaning
●CMS

11
Transistor Layer

11. Lithography


[Products used in this process]
●Vacuum Seals
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon parts
●Process Parts Cleaning
●Thermo-electric Modules
●CMS

12
Transistor Layer

12. Lithography


[Products used in this process]
●Vacuum Seals
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon parts
●Process Parts Cleaning
●Thermo-electric Modules
●CMS

13
Transistor Layer

13. Lithography


[Products used in this process]
●Vacuum Seals
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon parts
●Process Parts Cleaning
●Thermo-electric Modules
●CMS

14
Transistor Layer

14. Etching


[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon carbide parts
●Silicon parts
●Process Parts Cleaning
●CMS

15
Transistor Layer

15. Ion implantation


[Products used in this process]
●Quartz
●Silicon parts
●Process Parts Cleaning
●CMS

16
Transistor Layer

16. CVD


[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon carbide parts
●Silicon parts
●Process Parts Cleaning
●CMS

17
Wiring

17. Lithography


[Products used in this process]
●Vacuum Seals
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon parts
●Process Parts Cleaning
●Thermo-electric Modules
●CMS

18
Wiring

18. CVD


[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon carbide parts
●Silicon parts
●Process Parts Cleaning
●CMS

19
Wiring

19. Wiring


[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon parts
●Process Parts Cleaning
●CMS

20
Wiring

20. Wiring


[Products used in this process]
●Vacuum Seals
●Quartz
●Ceramics
●SiC Parts (CVD-SiC)
●Silicon parts
●Process Parts Cleaning
●CMS

21
Assembly / Inspection

21. Assembly
Cut the wafer into chips
Seal with ceramic resin

[Products used in this process]

22
Assembly / Inspection

22. Inspection
Check functionality,
environmental characteristics,
reliability, etc

[Products used in this process]
●Ceramics

23
Assembly / Inspection

23. Completion
Print serial number
and it’s ready


[Products used in this process]

●Quartz

Quartz Products

Outer
tube

Quartz Products

Wafer boat

Quartz Products

Cleaning chamber

●Silicon carbide parts

Quartz Products

Wafer boat

Quartz Products

Inner
tube

Quartz Products

Injector

●SiC Parts (CVD-SiC)

Quartz Products

Wafer
boat

Quartz Products

Wafer boat
assembly

Quartz Products

Silicon carbide
dummy wafer

●Ceramics

Quartz Products

Wafer tray
& hand

Quartz Products

Wafer
clamp

Quartz Products

Probe card

●Thermo-electric Modules

Quartz Products

Cooling
plate

Quartz Products

Cooling
plate
(internal structure)
Ferrotec's consumables that support semiconductor manufacturing.

▶︎End products

DRAM
Logic
3D NAND
line
glass
frame
DRAM
Logic
3D NAND
Battery
Case
Text
Mobile handset, tablet, datacenter

Manufacturing equipment examples

Lithography

Coater/developer
(resist coating)
Exposure equipment
(exposure and development using photomask)
Etching

EtchingEtching

Dry etching equipment
(plasma etching)
Cleaning

CleaningCleaning

Wet etching equipment
(liquid etching)
CVD

CVDCVD

CVD equipment
(insulating film forming)
CMP

CMPCMP

(polishing / planarization)
Ion implantation

Ion implantationIon implantation

(Formation of Element)
Wiring

WiringWiring

CVD equipment + Dry etching equipment
+ Sputtering equipment+ Plating equipment
+ CMP equipment
Semiconductor
manufacturing process▶︎		 Silicon base 24 Lithography 25 Etching 26 Cleaning 27 CVD 28 CMP 2 Ion implantation 30 Wiring Assembly
・Inspection
Lithography Etching Process Tools Parts Cleaning CVD CMP Ion implantation Wiring
Transistor layer 〜 Wiring / Multilayer wiring
▼ Products of Ferrotec used in each process
Vacuum Seals
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Quartz
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Ceramics
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SiC Parts (CVD-SiC)
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Silicon carbide parts
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Silicon parts
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Process Tool Parts Cleaning
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Thermo-electric Modules
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CMS
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