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- Vacuum Seals
- Quartz Products
- Ceramics
- SiC Parts (CVD-SiC)
- Silicon Parts
- EB Components
- Vacuum Coating System
- Silicon Wafers
- Reclaim Wafer
- Process Tools Parts Cleaning
- Single Crystal Silicon Ingot Puller
- Quartz Crucibles
- Ferrofluid
- Thermo-electric Modules
- Chillers
- Thermistors
- Power Electronic Substrates
- Photovoltaic Silicon
- Saw Blades
- Industrial Knives and Cutters
- CMS
- Industrial Laundry Machine">
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- Vacuum Seals
- Quartz Products
- Ceramics
- SiC Parts (CVD-SiC)
- Silicon Parts
- EB Components
- Vacuum Coating System
- Silicon Wafers
- Reclaim Wafer
- Process Tools Parts Cleaning
- Single Crystal Silicon Ingot Puller
- Quartz Crucibles
- Ferrofluid
- Thermo-electric Modules
- Chillers
- Thermistors
- Power Electronic Substrates
- Photovoltaic Silicon
- Saw Blades
- Industrial Knives and Cutters
- CMS
- Industrial Laundry Machine
- The Equipment Related Business
- Electronic Device Business
- Photovoltaic Related Products
- Other Related Business
Electronic Device Business
Power Electronic Substrates
DCB / AMB / DBA / DPC
Heat Dissipation and Insulation substrates that utilize our thermoelectric module manufacturing technology.
In our company’s Heat Dissipation and Insulation substrates, which utilize our thermoelectric module manufacturing technology, organic and metal substrates are commonly used for low-power household appliances and PCs. However, for insulated heat dissipation circuit substrates handling high power, substrates such as alumina oxide (Al₂O₃), aluminum nitride (AlN), and silicon nitride (Si₃N₄) are used.
Particularly, silicon nitride substrates are attracting attention for power modules in inverters/converters for electric vehicles. Our company has one of the world's largest production capacities for both conventional DCB (Direct Copper Bonding) substrates and AMB (Active Metal Brazing) substrates.
Additionally, we can manufacture DPC(Direct Plated Copper) substrates for data centers in the fifth-generation mobile communication system (5G), as well as DBA (Direct Bonded Aluminum) substrates used in parts requiring high reliability and heat dissipation characteristics, such as in cars, railways, and renewable energy.
DCBDirect Copper Bonding
DCB Substrate
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DCB (Direct Copper Bonding) substrates are electronic components in which copper plates are directly bonded to a ceramic substrate such as alumina (Al₂O₃) or alumina zirconia (Al₂O₃/ZrO₂), and then forming a copper circuit. They are widely used in power devices that require both electrical insulation and efficient heat dissipation.
Applications include industrial equipments, power supplies, home appliances, automotive components, and more.
AMBActive Metal Brazing
AMB Substrate
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AMB (Active Metal Brazing) substrates are electronic components in which copper plates are bonded to a ceramic substrate such as aluminum nitride (AlN) or silicon nitride (Si₃N₄) using active metal brazing materials, and then forming a copper circuit. Offering higher reliability and better heat dissipation than DCB substrates.
Applications include EVs, Electric trains, Power transmission systems, and industrial equipment, and more.
DBADirect Bonded Aluminum
DBA Substrate
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DBA (Direct Bonded Aluminum) substrates are electronic components in which aluminum is directly bonded to a ceramic substrate such as aluminum nitride (AlN) or alumina (Al₂O₃), and then forming an aluminum circuit. With excellent thermal shock resistance and electrical characteristics, it is an ideal material for high-voltage, large-current power devices.
Applications include Renewable energy, Electric trains, EVs, and more.
DPCDirect Plated Copper
DPC Substrate
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DPC (Direct Plated Copper) substrates form high-precision copper circuit patterns on ceramic substrates using electroplating methods. Surface treatment improves anti-oxidation properties and solder wettability, resulting in better component performance and high reliability.
Applications include optical communication, high-power semiconductor laser, high-power LEDs, LiDAR, and more.
Silicon Nitride Ceramic Substrate
Silicon Nitride Ceramic Substrate
Major Applications of Power Semiconductors
Power transmission system
Reduction of power loss
Electric train
Miniaturization and weight reduction of inverter equipment
EV, HV
Miniaturization and weight reduction of cooling system
Production equipment
Reduction of power loss
Solar battery
Higher efficiency of power conditioner
Air conditioner
Energy saving
Personal computer
AC adapter miniaturized and built into the Personal computer
Server machine
Reduction of power loss
Power Semiconductor Substrate Location Map
FerroTecTokyo
Tokyo
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Ferrotec Power Semiconductor Japan Corp.
FerroTecDongtai
Dongtai Factory
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Jiangsu Ferrotec Semiconductor Technology Co. Ltd.
FerroTecShanghai
Shanghai Factory
FerroTecDongtai
Dongtai R&D Center
FerroTecSichuan
Sichuan Factory
FerroTecMalaysia
Malaysia Factory
Detailed Information on this Technology
- Ferrotec Power Semiconductor Japan Corp.
- Power Electronic Substrates
- https://ftpowersemi.co.jp/en/
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